| MOQ: | 1 |
SMT | ||
Solder Paste Printing Accuracy | ±0.025 mm | |
Max Solder Paste Printing Speed | 150 mm/s | |
Solder Paste Printing | PCB Thickness: 0.2–6 mm | |
SMT Accuracy | ±0.05 mm | |
SMT Speed | 0.048 sec/component | |
Max SMT PCB Size | 400 * 510 mm | |
Min SMD Resistor & Capacitor Size | 0201 | |
Min BGA R-VTx Pitch | 0.35 mm | |
Reflow Soldering Temperature Accuracy | ±4°C | |
Reflow Soldering Zones | 8 | |
Reflow Soldering | Lead-free | |
AOI Accuracy | ±0.0024 mm | |
AOI Speed | 5 in²/s (60 FOV/s) | |
AOI Capable Components | 0201 Chips & Fine Pitch | |
X-ray Inspection | BGA Voids (0.35 mm Pitch) | |
BGA Rework Station | Capable | |
PCB | ||
Layers | 1–24 layers | |
Max Panel Size | 558 * 670 mm | |
Min Board Thickness | 4 layers: 0.40 mm | |
6 layers: 0.80 mm | ||
8 layers: 1.00 mm | ||
10 layers: 1.20 mm | ||
Min Line Width/Spacing | 0.065 mm | |
Min Line Spacing to PSD | 0.09 mm | |
Min Line Width Tolerance | +/- 10% | |
Min Finished Hole Size | 0.10 mm | |
Hole Wall Copper Thickness | Max 35 µm | |
Max Copper Thickness in Pattern | 210 µm | |
PTH Hole Diameter Tolerance | 0.05 mm | |
NPTH Hole Diameter Tolerance | 0.025 mm | |
Aspect Ratio | 10:01:00 | |
Hole Position Accuracy | Min +/- 0.05 mm | |
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