| MOQ: | 1 |
| Price: | €3.16-9.01 |
Quality Standard | IAFT 16949 Tier 1 Manufacturer | |||
Traceability | QR Code Laser printing in MES system | |||
Max Stencil Size | 1560mm*450mm | |||
Min SMT Package | 0201 | |||
Min IC Pitch | 0.3mm | |||
Max PCB Size | 1200mm*400mm | |||
Min PCB Thinkness | 0.35mm | |||
Min Chip Size | 01 005 | |||
Max BGA Size | 74mm*74mm | |||
BGA Ball Pitch | 1.0-3.00 | |||
BGA Ball Diameter | 0.2 - 1.0mm | |||
QFP Lead Pitch | 0.2mm-2.54mm | |||
SMT Capacity | 6 million points per day | |||
Change Line Time | Within 30 minutes | |||
DIP Capacity | Automatic Wave soldering, 6000 sets per day | |||
dispensing | Selective dispensing | |||
Conformal coating | Automatic coating | |||
Test | AOI, IC programming, ICT, FCT,Function test | |||
Aging | High temperature, Low Temperature | |||
Conformal coating | Automatic coating | |||
Housing | Automatic assembly line,Automatic screw |
PCB Specification | FR-4,1.6mm tickness,1OZ,2-10Layer HDI stackup,HASL-LF |
Processor | ARMCortex-M4,168MHz |
Memory | 128KBRAM,512KBFlash,MicroSD slot(up to32GB) |
Power Consumption | 3.3V,<1μA static,<30mA dynamic |
Connectivity | Wi-Fi,BLE 4.2 Ethemet(10/100Mbps) |
I/OInterfaces | 32GPIO.6ADC(12-bit).8PWM.12C,SP1.UART |
Signal Processing | 0-3.3V analog input,DSP instructions |
Temperature Range | -40°Cto+85°operating,-40°Cto+125Cstorage |
Physical Size | 50mm×30mm×2mm |
Development Environment | C,C++,Python,Arduino IDE,PlatformlO |
Security Features | AES-128,SHA-256,SecureBootTamper-proofdesign |
Certifications | RoHS |
Additional Features | Deepsleepmode,RTC with battery back up,built-in Additional Features temperature/humidity sensor,expansion header pins |
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