Multilayer Turnkey PCB Assembly Custom PCB Fab and Assembly ISO 9001 Certified

HTF provides custom prototype HDI multilayer PCB and PCBA board manufacturing services with comprehensive circuit board fabrication and assembly capabilities from our ISO9001 certified facility in Guangdong, China. Our custom prototype service is engineered for electronics development teams requiring rapid, flexible PCB fabrication and PCBA assembly for design validation, proof-of-concept builds, and small-batch production. The manufacturing platform supports rigid PCB constructions on FR4, aluminum, ceramic, and CEM1 base materials with 1-24 layer configurations, board thickness from 0.4mm to 6mm, and board dimensions customizable up to 1200mm maximum. Copper thickness options range from 0.5-6 OZ with standard 1 OZ and 2 OZ offerings available, supporting both fine-pitch signal routing and high-current power distribution within the same design. Manufacturing precision of 0.15mm/3-4mil minimum line width and spacing with 0.15mm minimum hole size supports high-density HDI routing requirements, while multiple surface finishing options including HASL, immersion gold, flash gold, plated silver, and OSP provide the appropriate surface treatment for each design's assembly and application requirements. Comprehensive testing including AOI, X-Ray, and functional test ensures quality verification at every manufacturing stage. ISO9001, ISO14001, CE, and RoHS certifications provide documented quality, environmental, safety, and material compliance for electronics products destined for global markets.

• Custom Prototype HDI Multilayer Manufacturing: Fully customizable prototype HDI PCB and PCBA production from single unit quantities, supporting rapid design iteration with the same manufacturing quality and precision as volume production for design validation and proof-of-concept builds.
• 1-24 Layer with 0.1mm Precision: Complete layer count range from single-sided to 24-layer multilayer with 0.15mm/3-4mil minimum line width and spacing, supporting complex HDI designs requiring fine-pitch routing and high-density interconnections.
• Multi-Material Platform: FR4 standard with aluminum metal-core for thermal management, ceramic substrates for high-frequency and high-temperature applications, and CEM1 composite for cost-optimized single-sided designs, providing material flexibility for diverse application requirements.
• Multiple Surface Finishes: HASL for general-purpose cost-effectiveness, immersion gold (ENIG) for fine-pitch components and excellent planarity, flash gold for contact applications, plated silver for high-frequency performance, and OSP for RoHS-compliant lead-free assembly.
• 0.15mm Minimum Hole Size: Precision drilling capability supporting microvia and small through-hole technologies for high-density HDI and multilayer designs, enabling compact board layouts with dense component placement.
• ISO9001 and CE Certified Quality: Internationally recognized quality management certification combined with European product safety compliance and RoHS material restriction conformity, providing documented manufacturing quality for regulated global markets.
• One-Stop OEM with AOI X-Ray Testing: Complete PCB fabrication, component assembly, and comprehensive testing service including automated optical inspection and X-ray verification as a single-source OEM supplier with 1-year warranty coverage.

This custom prototype HDI multilayer PCB and PCBA manufacturing service supports diverse electronics development and production applications. Consumer electronics developers utilize our prototype PCB service for smartphone peripheral boards, wearable device PCBs, and smart home controller modules where 1-24 layer capability and multi-material options support compact high-density designs. Industrial equipment manufacturers depend on our certified manufacturing for automation controller PCBs, sensor interface modules, and motor drive boards where ISO9001 certification and comprehensive testing ensure reliable operation. Automotive electronics suppliers leverage our rigid PCB fabrication for body control modules, LED lighting boards, and infotainment interface PCBs where aluminum substrates provide thermal management. IoT product teams use our prototype-to-production service for gateway devices, wireless sensor nodes, and connected device control boards with FR4 and ceramic material options. Medical device developers partner with us for diagnostic equipment PCBs and monitoring device assemblies where CE and RoHS compliance supports regulatory requirements.

Each PCB and assembled PCBA is individually vacuum-sealed in anti-static packaging with desiccant, then packed in protective export-grade cartons measuring 32.0*32.0*32.0 cm per single unit with 0.5 kg gross weight. Our ISO9001 and ISO14001 certified quality and environmental management systems govern every manufacturing stage from incoming raw material inspection through final functional testing and packaging. Incoming base materials including FR4, aluminum, ceramic, and CEM1 substrates undergo specification verification including dielectric properties, dimensional tolerance, and surface quality inspection. PCB fabrication employs controlled etching for 0.15mm/3-4mil minimum line width and spacing with copper thickness options from 0.5-6 OZ per customer requirements. Surface finishing processes including HASL, immersion gold, flash gold, plated silver, and OSP are applied per design specifications to ensure optimal solderability and shelf life. Comprehensive testing includes automated optical inspection for trace quality and registration, X-ray inspection for internal layer alignment and hidden interconnection verification, and functional testing for electrical continuity and performance. ISO9001 quality management, ISO14001 environmental management, CE product safety, and RoHS material compliance certifications support customer quality audits and product conformity for international markets. A 1-year warranty covers manufacturing defects for all PCB and PCBA products.