Electronics PCBA which we mainly produce: consumer electronics, loT devices,industrial control equipments,New energy products, medical equipment, automobile parts, aerospace equipment and others.
| MOQ: | 50 |
| Price: | $1.60-5.67 |
item | value |
Place of Origin | China |
Guangdong | |
Brand Name | Leadsintec |
Base Material | FR-4, Aluminum |
Copper Thickness | 0.5-4OZ |
Board Thickness | 0.5-4mm |
Min. Hole Size | 0.2mm |
Min. Line Width | 0.1mm |
Min. Line Spacing | 0.1mm |
Surface Finishing | LF-HASL, ENIG, OSP |
Board Size | According to custom requests |
Product name | PCB Board Assembly |
Application | Electronics Device,Medical, automotive, industrial control, agriculture |
Service | OEM Services Provided |
Certificate | ISO9001 |
Material | FR4 /aluminum/ceramic CEM1 |
color | Green. Red. Blue. White. Black.Yellow |
Testing Service | AOI X-Ray Function Test |
Layer | 1-42 Layers |
Surface Finish | LF-HASL, ENIG, OSP |
Files Requested | Gerber, BOM, Pick-place |
Production Capacity PCB&PCBA Customization and Production Capacity*Introduction of Leadsintec, what customization service we provide, production capacity. specifications of PCB and other services | ||
PCB Department : | 3 Production Line | |
PCBA Department : | 8 SMT Lines, 3 Waving Soldering, 2 DlP Lines, 5 AOl, 1 X-ray | |
PCB Specifications | ||
Material : | Flex/Rigid/Composite/Aluminum/Ceramic Substrate | |
Board Thickness : | from 0.8mm-4.0mm | |
Copper Thickness : | from 0.5-40Z | |
PCB Specifications | Layers: 1-42 | |
Surface Finish : | HASL, ENIG, OSP, Plating Au, lmmersion Silver, etc | |
SMT precision: | chip:±0.03mm IC:±0.025mm | |
Maximum daily capacity: | 9.07 million points/11 h | |
Max Board Size : | 1200*500mm | |
Tolerance of Board Thickness : | ±5% | |
Tolerance of Board Outlines : | ±0.15mm | |
Minimum line/space : | 0.1mm | |
Mini Hole Size(mechanical): | 0.2mm | |
PCB Assembly Capacities | ||
Files needed : | Gerber,BOM, Pick-Place,etc | |
MMinimum IC Pitch : | 0.2mm | |
Maximum PCB size : | 1200x 500mm | |
Minimum PCB thickness : | 0.25mm | |
Minimum chip size : | 0201(0.2x0.1)/0603(0.6 x0.3mm) | |
Maximum BGA size: | 74x74mm | |
BGA ball pitch : | 1.00mm(minimum),3.00mm(maximum) | |
BGA ball diameter : | 0.40mm(minimum),1.00mm(maximum) | |
QFP lead pitch : | 0.38mm(minimum),2.54mm(maximum) | |
Assembling Methods : | SMT. DIP,Wave Soldering, etc | |
Stencil size : | 736x736mm | |
Package Placing : | 0201,0402,0603,0805,1206 | |