| MOQ: | 1 |
| Price: | $0.50 |
PCB capability | PCB capability | |
Item | PCB capability | |
Numbr of Layer | 1-16 Layers (standard) | |
Material | FR4, Aluminum, FPC | |
Surface Finish | HASL(LF), Gold plating, Enig,Immersion gold, Immersion Tin, OSP | |
Finish Board Thickness | 0.2mm-6.00 mm(8mil-126mil) | |
copper Thickness | 1/2 oz min;12 oz max | |
Solder Mask | Green/Black/White/Red/Blue/Yellow | |
Min.Trace width & Line Spacing | 0.075mm/0.1mm(3mil/4mil) | |
Min.Hole Diameter for CNC Driling | 0.1mm(4mil) | |
Min.Hole Diameter for punching | 0.9mm(35mil) | |
Biggest panel size | 610mm*508mm | |
Hole Positon | +/-0.075mm(3mil) CNC Driling | |
Conductor Width(W) | 0.05mm(2mil)or;+/-20% of original artwork | |
Hole Diameter(H) | PTH L:+/-0.075mm(3mil);Non-PTH L:+/-0.05mm(2mil) | |
Outline Tolerance | 0.125mm(5mil) CNC Routing;+/-0.15mm(6mil) by Punching | |
Warp & Twist | 0.70% | |
Insulation Resistance | 10Kohm-20Mohm | |
conductivity | <50ohm | |
Test Voltage | 10-300V | |
Panel Size | 110×100mm(min);660×600mm(max) | |
Layer-layer misregistration | 4 layers:0.15mm(6mil)max;6 layers:0.25mm(10mil)max | |
Min,spacing between hole edge to circuity pattern of an inner layer | 0.25mm(10mil) | |
Min.spacing between board ouline to circuitry pattern of an inner layer | 0.25mm(10mil) | |
Board thickness tolerance | 4 layers:+/-0.13mm(5mil);6 layers:+/-0.15mm(6mil) | |
Impedance Control | +/-10% | |
Different Impendance | +/-10% | |
PCB Lead Time | ||||
Layer | Quick Turn/ Usual Time | Mass Production | ||
2L | 24hours /4 days | 8-10 days | ||
4L | 48hours /5 days | 10-12 days | ||
6L | 72hours /6 days | 12-14 days | ||
8L | 72hours /7 days | 16-18 days | ||
10L | 96hours /8 days | 18-20 days | ||
≥12L | 96hours /10 days | 18-20 days | ||