| MOQ: | 1 Piece |
| Price: | $0.5-$30/Piece |
| Standard Packaging: | Standard Anti-Static Package, 5X5X5 cm Per Unit, 0.5 kg Gross Weight |
| Delivery Period: | 5-15 Working Days |
| Payment Method: | T/T,PayPal,L/C,Western Union |
| Supply Capacity: | 500000 Pieces/Month |
HTF offers an extensive selection of PCB base materials, copper weights, and surface finishing options for through-hole assembly, empowering electronics designers to match board characteristics precisely to application requirements without compromise. Our material portfolio spans standard FR4 for cost-effective general applications, high-Tg FR4 for elevated temperature environments, CEM1 and CEM3 composites for consumer products optimizing cost-performance balance, FR1-4 phenolic for basic single-sided boards, polyimide for flexible circuits, copper-core substrates for extreme thermal management, and aluminum-base PCBs for LED lighting and power electronics. Each material is available with copper foil weights from 0.5 oz for fine-resolution signal traces to 6 oz for high-current power distribution, paired with surface finish options including cost-effective lead-free HASL, high-performance ENIG for flat pads and extended shelf life, and immersion silver for high-frequency applications. This material-finish matrix enables optimized board performance for every application from budget-constrained consumer products to performance-critical industrial and medical electronics, all manufactured under ISO 9001 certified quality management with full RoHS and CE compliance.
Key Features| Parameter | Specification |
|---|---|
| Base Materials | FR4, CEM1, CEM3, FR1-4, PI (Polyimide), CU (Copper), Aluminum |
| FR4 Tg Options | 130°C, 150°C, 170°C, 180°C |
| Board Thickness | 0.4-6mm |
| Copper Thickness | 0.5-6OZ |
| Surface Finishes | Lead-Free HASL, ENIG, Immersion Silver |
| Min Hole Size | Customization (0.2 mm Minimum) |
| Min Line Width | 0.15mm |
| Min Line Spacing | 3-4mil |
| Testing Service | Visual, AOI, ICT, Functional |
| Certificate | ISO9001, RoHS, CE |
HTF material and finish options for through-hole assembly enable optimized solutions across diverse electronic applications. Consumer electronics manufacturers producing cost-sensitive products including remote controls, LED bulb drivers, and small appliance controllers specify CEM1 single-sided boards with lead-free HASL finish for optimal performance-to-cost ratio in high-volume production. Industrial power electronics applications including welding machine control boards, UPS power stages, and battery charger modules utilize heavy-copper FR4 with 3.5–6 oz copper for high-current bus bars and power semiconductor mounting where copper cross-sectional area directly determines current handling capacity and thermal performance. LED lighting manufacturers developing street lights, floodlights, and horticultural grow lights select aluminum-base PCBs with ENIG finish for optimal thermal management and long-term solder joint reliability in elevated-temperature continuous operation. RF and wireless communication products including antenna tuning units, RF power amplifiers, and microwave transceiver modules benefit from immersion silver finish on FR4 or high-frequency laminate substrates providing the low insertion loss and stable impedance characteristics required for gigahertz-frequency signal integrity. Automotive under-hood electronics including engine sensors, actuator drivers, and transmission control modules specify high-Tg FR4 with ENIG finish for reliable operation through extreme temperature cycling and vibration exposure over the vehicle service lifetime.
Packaging & Quality AssuranceAll through-hole assemblies are inspected per IPC-A-610 criteria and tested to customer specifications. Material certificates traceable to laminate manufacturer lot numbers are maintained for every production batch. Standard packaging uses anti-static bags at 5×5×5 cm per unit with 0.5 kg gross weight. ISO 9001 certified quality management, full RoHS compliance for all materials and finishes, and CE product conformity ensure international regulatory acceptance for global distribution across all served markets and application sectors.