| MOQ: | 1 |
Lot Size | |||||||||
ITEM | Normal | Special | Remark | ||||||
PCB(Used for SMT )spec | (L*W) | Min | L≥50mm W250mm | L≤50mm | Includes the Process Edge | ||||
Max | Ls460mm Ws400mm | L>460mm W>400mm | |||||||
(T) | Min thickness | 0.5mm | T≤0.5mm | ||||||
Max thickness | 4.5mm | T>4.5mm | |||||||
SMT componentsspec | outlinedimensi on | Min size | 201 (0.6mm*0.3mm) | 1005 (0.3mm*0.2mm) | / | ||||
Max size | 200mm*125mm | 200mm*125mm < SMD | |||||||
component thickness | T≤6.5mm | 6.5mm < Ts15mm | |||||||
QFP.SOP.SoJ(multipins) | Min pin space | 0.4mm | 0.3mmsPitch < 0.4mm | ||||||
CSP,BG A | Min ball space | 0.5mm | 0.3mm≤Pitch < 0.5mm | ||||||